金风科技融资融券信息(11-22)

<span style="font-size: 14px; font-family: simsun; white-space: normal; text-transform: none; word-spacing: 0px; float: none; font-weight: normal; color: rgb(0,0,0); font-style: normal; orphans: 2; widows: 2; display: inline !important; letter-spacing: normal; background-color: rgb(255,255,255); text-indent: 28px; font-variant-ligatures: normal; font-variant-caps: normal; -webkit-text-stroke-width: 0px”>金风科技2018-11-22融资融券信息显示，金风科技融资余额592,083,023元，融券余额4,696,070元，融资买入额14,685,827元，融资偿还额25,601,508元，融资净买额-10,915,681元，融券余量435,628股，融券卖出量20,500股，融券偿还量10,600股，融资融券余额596,779,093元。金风科技融资融券详细信息如下表：